STUPIDSID
Answer any one question from Q1 and Q2
1 (a)
Explain the concept of reliability with Bathtub curve. Explain the terms MTBF and MTTF.
10 M
1 (b)
Explain how the environmental conditions affect the reliability of any instrument or system.
8 M
2 (a)
Explain how ergonomic & aesthetic design considerations are taken care in case of digital multimeter.
6 M
2 (b)
Explain different reliable soldering practices. State their advantages and limitations.
6 M
2 (c)
State the various design considerations for microprocessor based system.
6 M
Answer any one question from Q3 and Q4
3 (a)
What are the various factors affecting choice of Op-amp in signal conditioning applications.
8 M
3 (b)
Explain important specifications of ADC and DAC from design point of view.
8 M
4 (a)
Explain the need of VREF in ADC. Explain the factors to be considered while selecting VREF. Discuss on error budget depending upon VREF and number of output bits.
8 M
4 (b)
Explain the need of instrumental amplifier in analog signal conditioning. Explain errors occurring in instrumentation amplifier.
8 M
Answer any one question from Q5 and Q6
5 (a)
Explain working principal of analog resistive touch screen. Interface 4 wire resistive touch screen with microcontroller.
8 M
5 (b)
Explain the selection of microcontroller to particular application on the basis of
i) IO Pins
ii) Counters
iii) RAM & ROM
iv) Type of architecture
i) IO Pins
ii) Counters
iii) RAM & ROM
iv) Type of architecture
8 M
6 (a)
Explain I 2 C and SPI protocols with applications and limitations.
8 M
6 (b)
With neat diagram explain how to interface keyboard & LCD with microcontroller.
8 M
Answer any one question from Q7 and Q8
7 (a)
Explain different factors affecting the choice between Assembly Language and High Level Language.
10 M
7 (b)
Explain how In-Circuit Emulator is used in software development.
8 M
8 (a)
Explain in details Waterfall model of software design.
10 M
8 (b)
Write notes on:
i) Compiler
ii) Assembler
i) Compiler
ii) Assembler
8 M
Answer any one question from Q9 and Q10
9 (a)
List the EMI/EMC considerations in PCB designing. Explain how you will minimize the spreading of RF in multilayer PCB.
8 M
9 (b)
What are the issues to be considered in ensuring signal integrity in high speed circuits?
8 M
10 (a)
What is requirement of shielding and guarding in electronic products? Explain different types of the same.
8 M
10 (b)
Explain different design considerations in the design of PCBs for high speed digital circuits.
8 M
Answer any one question from Q11 and Q12
11 (a)
With the help of block diagram, explain the implementation of radio link.
10 M
11 (b)
Write a short note on:
i) Phase Locked Loop
ii) Interleaver
i) Phase Locked Loop
ii) Interleaver
6 M
12 (a)
Explain with reasons the selection of particular band of frequency spectrum for various communication applications
10 M
12 (b)
Write short notes on:
i) Transmitter / Receiver Sensitivity
ii) Bit and Symbol error rates
i) Transmitter / Receiver Sensitivity
ii) Bit and Symbol error rates
6 M
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