Solve any one question from Q.1(a,b,c) &Q.2(a,b,c)
1(a)
Explain man machine dialogue.
8 M
1(b)
What are the issues while formulating a test plan?
8 M
1(c)
What are the mertics in software designing?
4 M
2(a)
What is shielding? Explain with neat diagrams.
8 M
2(b)
What are the performance and efficiency measures in hardware testing?
6 M
2(c)
Explain different software models with advantages and disadvantages.
6 M
Solve any one question from Q.3(a,b,c) &Q.4(a,b,c)
3(a)
What is bypassing and decoupling issue in PCB? Explain with suitable exampe.
6 M
3(b)
What are the grounding methodologies? Explain with suitable sketches.
6 M
3(c)
Write in brief about routing topologies.
6 M
4(a)
What is functional partitioning? Explain critical frequency concept.
8 M
4(b)
What are the techniques used in ESD protection.
6 M
4(c)
Calculate the characteristic impedance for a stripline geometry when the thickenss of PCB laminates is 1.6mm and its relative permittivity is 3.2. The width of embedded track is 1mm and its thickness is 35 microns.
4 M
Solve any one question from Q.5(a,b,c) &Q.6(a,b)
5(a)
What are role A to D coneverter in Product design? Explain the parameters while designing A to D converter.
6 M
5(b)
What is integration, verification and validation in electronic product designing?
6 M
5(c)
What is an operational amplifier explain with typical application.
4 M
6(a)
What is testing and debugging? Explain the steps in debugging.
8 M
6(b)
What are electromechanical components? Explain any two electromechanical components.
8 M
Solve any one question from Q.7(a,b,c) &Q.8(a,b)
7(a)
Define documentation and explain different types of documentation.
6 M
7(b)
What is accountability and lability?
6 M
7(c)
Write in brief on presentation and preservation of documents.
4 M
8(a)
What is the importance of bill of material? Explain bill of material with suitable example.
8 M
8(b)
Explain the layout of documentation.
8 M
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