SPPU Electronics and Telecom Engineering (Semester 7)
Electronics Product Design
December 2014
Total marks: --
Total time: --
(1) Assume appropriate data and state your reasons
(2) Marks are given to the right of every question
(3) Draw neat diagrams wherever necessary

Answer any one question from Q1 and Q2
1 (a) What is failure rate? What are the different types of failure? Write the phases at which the respective failure occurs.
8 M
1 (b) What are the factors responsible for unreliability of Electronic product (any four).
4 M
1 (c) What is exponential law of reliability? How to improve the reliability of electronic product.
6 M

2 (a) Define ergonomics. Explain man machine environment (MME) system as a close loop system with appropriate diagram.
6 M
2 (b) A sawtooth wave generator circuit uses following components with failure rates per 106 hours mention against them in table. Calculate total FR & MTBF of total circuit.
Components Quality FR × 10+6 hr
Resistors 10 0.61
Capacitors 5 0.60
Diodes 4 0.20
Transistors 2 0.65
Pulse transformer 2 0.15
Step down transformer 2 0.18
8 M
2 (c) Explain the different stages of electronic product development.
4 M

Answer any one question from Q3 and Q4
3 (a) An 8-channel ADC reads data using LM35. This data is to be logged in system RAM & a plot is drawn using a plotter.
i) Draw the block schematic of suggested DAS for above design requirement.
ii) Draw the flow chart for acquiring data & displaying it on a six digit multiplexed LCD display and print the output in plotter or printer.
iii) Explain the steps necessary to develop the s/w for proposed DAS.
10 M
3 (b) Explain IA with an important four specifications (Draw 3 ? OPAMP configuration IA).
8 M

4 (a) What are the different I/o devices interfaced with microcontroller? Explain any one I/f with 8051 MC.
8 M
4 (b) Compare any three microcontrollers (8 bit) on the basis of ROM,RAM,I/o pins & ports. State the main features of HB LED.
10 M

Answer any one question from Q5 and Q6
5 (a) Discuss the different topologies of touch screen. State the advantages & disadvantages of each. Explain any one technology in detail.
8 M
5 (b) Explain & specify the following protocols & buses used in microcontroller based project design.
i) 12C ii) RS232
4 M
5 (c) Discuss the criterion for LCD selection w.r. to microcontroller (any) in short.
2 M

6 (a) What parameters are to be considered while selecting high speed OPAMPS? Give any two applications of such OPAMPS.
4 M
6 (b) For the mini project that you designed justify
i) Selection of microcontroller.
ii) Selection of I/P & O/P devices.
iii) Type & size of memory.
iv) Controlling element if any.
8 M
6 (c) Explain different factors considered while selecting ADCs for any microcontroller based product in short.
2 M

Answer any one question from Q7 and Q8
7 (a) Classify the different software development approaches. Explain with blocks the water fall model.
6 M
7 (b) What is the role of simulator in software design? List the different simulation tools with their application domain.
6 M
7 (c) What is an emulator? Explain with block diagram the ICE.
6 M

8 (a) What is the necessity of hardware test programs? Explain POST, Inquisitor, HLL as H/W test utilities.
6 M
8 (b) Compare the following (any two):
i) High level language & low level language.
ii) Assembler & compiler.
iii) Flow chart with pseudo code.
6 M
8 (c) Write short note on (any two):
i) UMPS or IDE
ii) Debugger or OCD.
iii) Top down approach.
6 M

Answer any one question from Q9 and Q10
9 (a) What problems are avoided while designing PCBs for digital circuits? What is cross talk? How to minimise the cross talk in designing PCBs.
8 M
9 (b) In a multilayer PCB, signal & ground plane is separated by 0.5 inch, common area of two planes is 5.25 inch2 . Then find the parasitic capacitor for relative permittivity & substrate r = 2.5.
4 M
9 (c) What methods are used to minimise the EMI/RFI effects from compliance testing point of view.
6 M

10 (a) Define the following terms w.r.to printed circuit board (any four)
i) Copper clad laminate
ii) Photo resist
iii) Vias
iv) Etching
v) Solder mask
8 M
10 (b) Compare between single sided & double sided PCBs.
4 M
10 (c) Explain the PCB design considerations for digital circuits.
6 M

Answer any one question from Q11 and Q12
11 (a) Explain the following parameters & also indicate their importance in case of RF link design.
i) SINAD ii) Fade margin
8 M
11 (b) Explain the detail working of Digital PLL.
6 M

12 (a) With reference to RF link analysis explain path loss & free space loss.
6 M
12 (b) Discuss the design considerations of the following blocks of communication systems
i) Interleaver
ii) Equalizer.
8 M

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