STUPIDSID
Answer any one question from Q1 and Q2
1 (a)
Discuss in details different stages of an electronic product development.
12 M
1 (b)
Find MTBF & MTTF
| Stage | Components | Type | Qty | Fr × 10-6 hr |
| Transformer | Winding | Stepdown | 01 | 4.4 |
| Rectifier | Diodes | Si type | 04 | 0.2 |
| Filter | Capacitor | Electrolytic | 02 | 0.3 |
| Regulator | Capacitor | Ceramic | 02 | 0.3 |
| Diode | Semiconductor | 02 | 0.2 | |
| Linear IC | ICLM317 | 02 | 0.6 | |
| Display | Linear | IC 7107 | 02 | 0.6 |
| Resistor | Carbon Camp | 04 | 0.2 |
6 M
2 (a)
Explain the Bath tub curve.
6 M
2 (b)
Explain the following terms in context with reliability of an electronic product.
i) MTTF
ii) MTBF
iii) MTTR
iv) Failure rate
i) MTTF
ii) MTBF
iii) MTTR
iv) Failure rate
6 M
2 (c)
With the help of block schematic explain in brief the factors affecting reliability of product.
6 M
Answer any one question from Q3 and Q4
3 (a)
Compare at least four types of ADCs w.r.t. parameters missing codes, differential & integral non-linearity, resolution & power consumption.
12 M
3 (b)
What is need of decoupling capacitor where it is located in the circuit.
4 M
4 (a)
Draw a circuit of instrumentation amplifier & explain gain equation with derivation. Explain its parameters slew rate, CMRR, bandwidth, offset.
10 M
4 (b)
Compare a least two DAC techniques with their selection criteria.
6 M
Answer any one question from Q5 and Q6
5 (a)
What are factors affecting selection of buses & protocols in high speed electronic product.
8 M
5 (b)
Draw typical wiring diagram for each interface Rs.485, Rs.432 I2C. Also state how many maximum device can interface with these buses.
8 M
6 (a)
Explain the different requirement of interfacing touch screen. What are the different touch screen available? Explain typical interfacing technique with example.
8 M
6 (b)
What are different factors for selecting a particular micro controller for application.
8 M
Answer any one question from Q7 and Q8
7 (a)
Mention factors affecting choice between assembly & high level language.
8 M
7 (b)
Explain different software debugging techniques.
8 M
8 (a)
Give some details of documentation practices & templates for assembly & C language?
8 M
8 (b)
Explain different approaches to develop an application software for electronic product.
8 M
Answer any one question from Q9 and Q10
9 (a)
Explain different design considerations while designing PCB for high speed digital circuits.
10 M
9 (b)
Estimate the parasitic values for following geometrics of PCB track.
i) Resistance of 20cm long copper track with 0.8mm width on standard 35 micron copper clad laminate [Resistivity of copper 1.72 x 10 -6 rm].
ii) Inductance of track having width 1mm length 25cm & thickness 70 microns.
i) Resistance of 20cm long copper track with 0.8mm width on standard 35 micron copper clad laminate [Resistivity of copper 1.72 x 10 -6 rm].
ii) Inductance of track having width 1mm length 25cm & thickness 70 microns.
8 M
10 (a)
State & explain the causes of losses along transmission lines. Explain circuitry required to overcome attenuation problems.
10 M
10 (b)
Explain:
i) Ground loops.
ii) Star grounding.
iii) Board level shielding.
iv) Guarding.
i) Ground loops.
ii) Star grounding.
iii) Board level shielding.
iv) Guarding.
8 M
Answer any one question from Q11 and Q12
11 (a)
Explain selection criteria of frequency bands in various applications. Also mention reason for selecting particular band for application.
8 M
11 (b)
Write short notes on:
i) Equalizer
ii) Interleaver
i) Equalizer
ii) Interleaver
8 M
12 (a)
What is communication link analysis explain various sources of signal loss & noise.
8 M
12 (b)
Write a notes on EMI & EMC standards.
8 M
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