SPPU Electronics and Telecom Engineering (Semester 7)
Electronics Product Design
June 2015
Total marks: --
Total time: --
(1) Assume appropriate data and state your reasons
(2) Marks are given to the right of every question
(3) Draw neat diagrams wherever necessary

Answer any one question from Q1 and Q2
1 (a) Discuss in details different stages of an electronic product development.
12 M
1 (b) Find MTBF & MTTF
Stage Components Type Qty Fr × 10-6 hr
Transformer Winding Stepdown 01 4.4
Rectifier Diodes Si type 04 0.2
Filter Capacitor Electrolytic 02 0.3
Regulator Capacitor Ceramic 02 0.3
  Diode Semiconductor 02 0.2
  Linear IC ICLM317 02 0.6
Display Linear IC 7107 02 0.6
  Resistor Carbon Camp 04 0.2
6 M

2 (a) Explain the Bath tub curve.
6 M
2 (b) Explain the following terms in context with reliability of an electronic product.
ii) MTBF
iii) MTTR
iv) Failure rate
6 M
2 (c) With the help of block schematic explain in brief the factors affecting reliability of product.
6 M

Answer any one question from Q3 and Q4
3 (a) Compare at least four types of ADCs w.r.t. parameters missing codes, differential & integral non-linearity, resolution & power consumption.
12 M
3 (b) What is need of decoupling capacitor where it is located in the circuit.
4 M

4 (a) Draw a circuit of instrumentation amplifier & explain gain equation with derivation. Explain its parameters slew rate, CMRR, bandwidth, offset.
10 M
4 (b) Compare a least two DAC techniques with their selection criteria.
6 M

Answer any one question from Q5 and Q6
5 (a) What are factors affecting selection of buses & protocols in high speed electronic product.
8 M
5 (b) Draw typical wiring diagram for each interface Rs.485, Rs.432 I2C. Also state how many maximum device can interface with these buses.
8 M

6 (a) Explain the different requirement of interfacing touch screen. What are the different touch screen available? Explain typical interfacing technique with example.
8 M
6 (b) What are different factors for selecting a particular micro controller for application.
8 M

Answer any one question from Q7 and Q8
7 (a) Mention factors affecting choice between assembly & high level language.
8 M
7 (b) Explain different software debugging techniques.
8 M

8 (a) Give some details of documentation practices & templates for assembly & C language?
8 M
8 (b) Explain different approaches to develop an application software for electronic product.
8 M

Answer any one question from Q9 and Q10
9 (a) Explain different design considerations while designing PCB for high speed digital circuits.
10 M
9 (b) Estimate the parasitic values for following geometrics of PCB track.

i) Resistance of 20cm long copper track with 0.8mm width on standard 35 micron copper clad laminate [Resistivity of copper 1.72 x 10 -6 rm].
ii) Inductance of track having width 1mm length 25cm & thickness 70 microns.
8 M

10 (a) State & explain the causes of losses along transmission lines. Explain circuitry required to overcome attenuation problems.
10 M
10 (b) Explain:
i) Ground loops.
ii) Star grounding.
iii) Board level shielding.
iv) Guarding.
8 M

Answer any one question from Q11 and Q12
11 (a) Explain selection criteria of frequency bands in various applications. Also mention reason for selecting particular band for application.
8 M
11 (b) Write short notes on:
i) Equalizer
ii) Interleaver
8 M

12 (a) What is communication link analysis explain various sources of signal loss & noise.
8 M
12 (b) Write a notes on EMI & EMC standards.
8 M

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