MU Electronics Engineering (Semester 8)
MEMS Technology
May 2016
Total marks: --
Total time: --
INSTRUCTIONS
(1) Assume appropriate data and state your reasons
(2) Marks are given to the right of every question
(3) Draw neat diagrams wherever necessary


1(a) Give few examples of MEMS device which are characterized by sensors and actuators.
5 M
1(b) Explain the sacrificial layer and its role in fabrication of MEMS devices.
5 M
1(c) What are the characteristics of Micro-heater?
5 M
1(d) In case of photolithography, Compare the two types of photo-resist used
5 M

2(a) Discuss the process of photolithography. Mention the types of photolithography suitable for at least two MEMS devices with justification.
10 M
2(b) Discuss selection of material based on applications. Support your answer by considering suitable example.
10 M

3(a) A 30 &mu
10 M
3(b) Explain Dry etching & Wet etching in fabrication process of MEMS devices.
10 M

4(a) Describe the representative process flow for fabricating the ink jet printer head by Hewlett-packard. Also explain the operating principle of this MEMS device in detail.
10 M
4(b) Differentiate between bulk and surface micromachining for fabrication of MEMS devices with suitable example.
10 M

5(a) State various Chemical Vapor Deposition techniques. Explain in brief the techniques of Chemical Vapor Deposition for MEMS device fabrication.
10 M
5(b) Explain transduction pertaining to microfilm strain gauge. State the factors that lead to thin film stress.
10 M

Write a short note on (any three)
6(a) Photolithography (Compare major types of exposure system)
7 M
6(b) Anodic bonding
7 M
6(c) Reliability of MEMs devices.
7 M
6(d) Applications of MEMS in Biomedical Instrumentation.
7 M



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